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R30

Remote I/O R30 Series

R30 SERIES GENERAL SPECIFICATIONS

Functions & Features
• Remote I/O modules which interchange analog or digital I/O signals with fieldbus (EtherCAT etc.).
 

ORDERING INFORMATION
Refer to the specifications of the respective modules for details.

NETWORK MODULE: R30[1]
Refer to the specifications of each module for details.

[1] MODULE TYPE
NCIE1: CC-Link IE Field
NE1: Ethernet (Modbus/TCP)
NECT1: EtherCAT

INTERFACE I/O MODULE: R30[1]S
Refer to the specifications of each module for details.

[1] MODULE TYPE
GCIE1: CC-Link IE Field

COMMUNICATION MODE
S: Single

BASE: R30[1][2]
Refer to the specifications of each base for details.

[1] MODULE TYPE
BS: Base

[2] NUMBER OF SLOTS
02: 2 slots
04: 4 slots
08: 8 slots
12: 12 slots
16: 16 slots

R3 I/O MODULE EXTENSION BASE: R30[1][2]
Refer to the specifications of each base for details.

[1] TYPE
TYPE
EBS: R3 I/O Module extension base

[2] NUMBER OF SLOTS
04: 4 slots
08: 8 slots

I/O MODULES: R30[1][2]
Refer to the specifications of each module for details.

[1] MODULE TYPE
• Analog Input
SV2: DC voltage/current input module, 2 points 
SV4: DC voltage/current input module, 4 points 
SVF4: DC voltage/current input module, high speed, 4 points
TS4: Thermocouple input module, 4 points
RS4: RTD input module, 4 points
MS4: Potentiometer input module, 4 points
CT4E: AC current input module, 4 points
US2: Universal input module, 2 points
US4: Universal input module, 4 points
• Analog Output
YV4: DC voltage output module, 4 points
YS4: DC current output module, 4 points (CE not available) 
• Pulse Input
PA2: Totalized pulse input module, 2 points
• Discrete Input
XN16A: Discrete input module, 16 points
• Discrete Output
YN16A: NPN transistor output module, 16 points
YN16C: PNP transistor output module, 16 points

[2] COMMUNICATION MODE
S: Single

POWER SUPPLY MODULE: R30[1]-[2]
Refer to the specifications of each module for details.

[1] MODULE TYPE
PS1: Power supply module (current capacity 750 mA)

[2] POWER INPUT
• DC power
R: 24 V DC

BLANK FILLER MODULE: R30[1]
Refer to the specifications of each module for details.

[1] MODULE TYPE
DM: Blank filler module

FUNCTIONS & FEATURES
The R30 Series Remote I/O consists of a network module, I/O modules, a power supply module and an installation base in free combinations and doesn't require complicated settings.
Internal high speed communication bus provides fast I/O responsce.
NETWORK MODULE
Converts data between open network fieldbus and I/O modules, functioning as a gateway.
INTERFACE I/O MODULE
It is available to handle the data on the open network fieldbus (CC-Link IE Field, etc.) with different protocol interface module. (Gateway module)
I/O MODULE
Transmits input data to the network module or outputs data received from the network module.
■ POWER SUPPLY MODULE
Converts DC power input for use in the network module and I/O modules.
■ BASE
Supplys internal power converted by the power supply module to the network module and I/O modules.  Connects the network module and internal communication bus of I/O modules.
The power supply module and network module each have a dedicated slot to mount.  Up to 16 I/O modules can be mounted. 

CAUTION
The internal bus communication period for R3 series I/O modules installed in R30EBS is as follows.
Internal bus communication period = 6 msec. x number of I/O module + 10 msec. (Data update period of main CPU)

 Example: Four R3 series I/O modules
   6 msec. x 4 + 10 msec. = 34 msec.
Even R30EBS is installed, the internal bus communication period of R30 series remains approx. 1 msec.

RELATED PRODUCTS
• PC configurator software (model: R30CFG)
• PC configurator software (model: R3CON)(Only for using R30EBS)
Downloadable at M-System’s web site.
For connecting to PC, use commercially available Mini-B type USB cable. (provided by user)

GENERAL SPECIFICATIONS
Connection: Depends upon the type of modules. Refer to the specifications for the respective modules.
Housing material: Flame-resistant resin (gray)
INTERNAL COMMUNICATION BUS
Read rate
: Approx. 1 msec.
DATA CONVERSION
Depends upon the type of I/O modules. Refer to the specification for the respective I/O modules.

INSTALLATION
Operating temperature: -10 to +55°C (14 to 131°F)
Storage temperature: -20 to +65°C (-4 to +149°F)
Operating humidity: 10 to 90 %RH (non-condensing)
Atmosphere: No corrosive gas or heavy dust
Mounting: Surface or DIN rail
Weight: Refer to the specifications of the respective modules.

STANDARDS & APPROVALS
EU conformity:
EMC Directive 
  EMI EN 61000-6-4
  EMS EN 61000-6-2
RoHS Directive
  EN 50581

CURRENT CONSUMPTION

BASIC CONFIGURATIONS

EXTERNAL DIMENSIONS unit: mm (inch)

MOUNTING REQUIREMENTS unit: mm (inch)

M-System Co., Ltd.