ES-7782 Rev.8
R6-ND1
Remote I/O R6 Series
DeviceNet INTERFACE MODULE
Functions & Features
• Free combination of analog and discrete I/O
• Direct sensor inputs
• Space-saving
• Low power consumption
Typical Applications
• Remote I/O for DCS and PLC
MODEL: R6-ND1[1]
ORDERING INFORMATION
• Code number: R6-ND1[1]
Specify a code from below for [1].
(e.g. R6-ND1/Q)
• Specify the specification for option code /Q
(e.g. /C01)
[1] OPTIONS
blank
: none
/Q
: With options (specify the specification)
SPECIFICATIONS OF OPTION: Q
COATING (For the detail, refer to our web site.)
/C01
: Silicone coating
/C02
: Polyurethane coating
RELATED PRODUCTS
• EDS file
(downloadable at our web site.)
GENERAL SPECIFICATIONS
Connection
DeviceNet
: Euro type connector terminal
(applicable wire size: 0.2 to 2.5 mm
2
, stripped length
7 mm)
Internal bus
: Via the Installation Base (model: R6x-BS)
Internal
power
: Via the Installation Base (model: R6x-BS)
Max. number of I/O modules
: 32 (analog 64 points)
Isolation
: DeviceNet to internal bus or internal power
Data allocation
: Mode 1 or 2 set with the side DIP switch
DeviceNet COMMUNICATION
Transmission cable
: Approved for DeviceNet
I/O data area size
: Input and output data area size set with side DIP SW
Node address setting
: DIP switch; 00 – 63
Baud rate setting
: DIP switch
125 kbps, 250 kbps, 500 kbps
NS (Network Status) indicator
: Bi-color (green/red) LED
indicates status of the communication link.
MS (Module Status) indicator
: Bi-color (green/red) LED
indicates device status.
INSTALLATION
Supply voltage to network
: 11 – 25 V DC supplied through the network terminal block
Supply current to network
: 50 mA max.
Operating temperature
: -10 to +55°C (14 to 131°F)
Operating humidity
: 30 to 90 %RH (non-condensing)
Atmosphere
: No corrosive gas or heavy dust
Mounting
: Installation Base (model: R6x-BS)
Weight
: 100 g (0.22 lb)
PERFORMANCE
Insulation resistance
: ≥ 100 MΩ with 500 V DC
Dielectric strength
: 2000 V AC @ 1 minute (DeviceNet to internal bus or internal power)
STANDARDS & APPROVALS
EU conformity
:
EMC Directive
EMI EN 61000-6-4
EMS EN 61000-6-2
RoHS Directive
EXTERNAL VIEW
TRANSMISSION DATA DESCRIPTIONS
The DIP SW located at the side of the module switches the unit’s data allocation mode.
In the Data Allocation Mode 1, one (1) word is assigned per module. The second channel of analog I/O modules cannot be used.
In the Data Allocation Mode 2, two (2) words are assigned per module regardless of whether the second word area is required or not, even for discrete I/O modules that require one (1) word.
A maximum of 32 I/O modules can be mounted per node.
I/O DATA DESCRIPTIONS
EXTERNAL DIMENSIONS unit: mm [inch]
SCHEMATIC CIRCUITRY & CONNECTION DIAGRAM