ES-6103 Rev.10
R5-ND1
Remote I/O R5 Series
DeviceNet INTERFACE MODULE
(for 16-point analog signals)
MODEL: R5-ND1[1]
ORDERING INFORMATION
• Code number: R5-ND1[1]
Specify a code from below for [1].
(e.g. R5-ND1/Q)
• Specify the specification for option code /Q
(e.g. /C01)
[1] OPTIONS
blank
: none
/Q
: With options (specify the specification)
SPECIFICATIONS OF OPTION: Q
COATING (For the detail, refer to our web site.)
/C01
: Silicone coating
/C02
: Polyurethane coating
/C03
: Rubber coating
RELATED PRODUCTS
• PC configurator software (model: R5CON)
• EDS file
The EDS file and configurator software are downloadable at our web site.
A dedicated cable is required to connect the module to the PC. Please refer to the internet software download site or the users manual for the PC configurator for applicable cable types.
GENERAL SPECIFICATIONS
Connection
DeviceNet
: Euro type connector terminal
(Applicable wire size: 0.2 – 2.5 mm
2
(AWG 24 to 12), stripped length 7 mm)
Internal bus
: Via the Installation Base (model: R5-BS)
Internal power
: Via the base (model: R5-BS)
Isolation
: DeviceNet to internal bus or internal power
Data allocation
: Mode 1 or 2 set with the side DIP switch
DeviceNet COMMUNICATION
Transmission cable
: Approved for DeviceNet
Node address setting
: DIP switch; 00 – 63
Baud rate setting
: DIP switch
125 kbps, 250 kbps, 500 kbps
NS (Network Status) indicator
: Bi-color (green/red) LED
indicates status of the communication link.
MS (Module Status) indicator
: Bi-color (green/red) LED
indicates device status.
INSTALLATION
Supply voltage to network
: 11 – 25 V DC supplied through the network terminal block
Supply current to network
: 50 mA max.
Operating temperature
: -10 to +55°C (14 to 131°F)
Operating humidity
: 30 to 90 %RH (non-condensing)
Atmosphere
: No corrosive gas or heavy dust
Mounting
: Installation Base (model: R5-BS)
Weight
: 100 g (0.22 lb)
PERFORMANCE
Insulation resistance
: ≥ 100 MΩ with 500 V DC
Dielectric strength
: 2000 V AC @ 1 minute (DeviceNet to internal bus or internal power)
STANDARDS & APPROVALS
EU conformity
:
EMC Directive
EMI EN 61000-6-4
EMS EN 61000-6-2
RoHS Directive
EXTERNAL VIEW
TRANSMISSION DATA DESCRIPTIONS
The DIP SW located at the side of the module switches the unit's data allocation mode.
The Data Allocation Mode 1 is used when all analog I/O modules are single-channel types. In this mode, one (1) word is assigned for one I/O module. The second channel on the dual-channel modules cannot be used. Max. 16 I/O modules can be used per station.
The Data Allocation Mode 2 is used when one or more analog I/O modules are dual-channel types. In this mode, two (2) words are assigned for one I/O module regardless of whether the second word area is required or not. For example, discrete I/O modules require only one (1) word, but two (2) words are automatically assigned to these modules.
■
I/O CAPACITY
In Data Allocation Mode 1, a maximum of 16 I/O modules can be mounted per node. If two-channel type analog modules are mixed, the second channel I/O cannot be used.
In Data Allocation Mode 2, a maximum of 8 I/O modules can be mounted per node.
I/O DATA DESCRIPTIONS
The data allocations for typical I/O modules are shown below.
Refer to the manual for each module for detailed data allocations.
■ANALOG 16 BITS DATA
■ 16-POINT DISCRETE DATA
■ 4-POINT DISCRETE DATA
EXTERNAL DIMENSIONS unit: mm [inch]
SCHEMATIC CIRCUITRY & CONNECTION DIAGRAM